Sealstrip Corporation will Exhibit at Pack Expo International

August 1, 2003

(Boyertown, PA) – Sealstrip Corporation will be exhibiting easy open and resealable flexible packaging technology at Pack Expo International 2004, McCormick Place, Chicago, IL USA, November 7-11, 2004, in booth S-670.

If you are looking to enhance your package with a great value-added feature your customers will love, consider a pressure sensitive, easy open and/or resealable option from Sealstrip.

Drop by our booth and let our packaging professionals introduce you to these truly convenient options:

We will have machinery running in several booths. Stay tuned for more details to come in 2004.

Pack Expo International 2004 is sponsored and produced by Packaging Machinery Manufacturers Institute (PMMI).

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